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Sierra Components Wafer Processing

Sierra Components - compoments in die form

For prototype quantities or high-volume production runs, Sierra Components is the answer to any wafer dicing requirements. Sierra Components can dice wafers in preparation for assembly or for Die Sales shipments to customers anywhere in the world, specializing in quick turn dicing. All of our dicing is done utilizing our World-Class Kulicke & Soffa Precision Dicing System. Sierra Components' highly experienced operators are experts in handling Silicon Wafers. We can provide 100% die inspection to MIL-STD-883 or Commercial specifications or we will train and certify our die inspectors to your custom specification. Sierra Components' wafer processing capabilities include:

  • Wafer Dicing
  • Pick & Place
  • Die Inspection
  • High Volume

Whether you need thousands of dice per month or 100 die today, Sierra Components is the supplier to choose. Sierra Components has built its reputation on providing customers with excellent quality and superior service in the die distribution business, now let us show you what we can do for your wafer processing requirements.

Sierra Components - compoments in die form

CAPABILITIES »

Contact Mike Gunderson or Russ Bacon for scheduling and pricing.

Sierra Components, Inc.
2222 Park Place, Suite 3-E
Minden, NV 89423

(775) 783-4940 x-1004
(775) 783-4947 Fax

mike@sierracomp.com
rbacon@sierracomp.com