Sierra Components Wafer Processing - Capabilities
Sierra Components will saw, clean and optically inspect your wafers and die in preparation for assembly or for Die Sales shipments to your customers. Visual inspections to commercial, MIL-STD-883 (Class B or Class S).
- Wafer Dicing - Fully Automatic World Class Kulicke & Soffa Precision Dicing systems handle wafers ranging from fragments to 8-inch diameter. Wafer cleanliness is maintained to a minimum of 5 Meg Ω resistivity quality DI water and anti-static work stations.
- Pick & Place - Semi-automatic pick & place available to place dice in waffle pack or GelPack is ideal for a wide range of die including those sensitive to topside handling.
- Die Inspection - 100% visual inspection available to the specification you need. All operators are trained & certified to commercial, Mil-STD-883, Method 2010 Cond A & B, and customer specific requirements.
- Quality & Service - Each order is entered on custom traveler generated for each customer's specific requirements allowing for reliable process flow.
- Sierra Components has built its reputation providing customers with: excellent quality and superior service.
Contact Mike Gunderson for scheduling and pricing.
Sierra Components, Inc.
2222 Park Place, Suite 3-E
Minden, NV 89423
(775) 783-4940 x-1004
(775) 783-4947 Fax